UW NNIN Site - Tool List
ABM Contact Aligner
| Coral ID: | ABM-Aligner |
| Manufacturer: | AB-M |
| Lab: | MFF |
| Area: | Lithography and Direct Patterning |
| Manual: | http://coral.engr.washington.edu/manuals/ABM-Aligner.pdf |
Description
Contact photolithography exposure tool for 100mm wafers. An optimized process can achieve 2 um line/space patterns with a layer-to-layer registration accuracy about 3 um.
Details
Uses 5in or 7in square photomasks with 0.090in thickness. Configured for exposure of 100mm wafers; smaller chips can be accomodated using a carrier wafer.
Materials Restrictions
(none)
Alpha Step Profilometer
| Coral ID: | Alphastep |
| Manufacturer: | Tencor |
| Model: | Alpha Step 200 |
| Lab: | MFF |
| Area: | Device and Structure Characterization |
| Manual: | http://coral.engr.washington.edu/manuals/Alphastep.pdf |
Description
Stylus profilometer for measuring vertical step heights in a wide range of materials.
Details
Vertical ranges of +/- 16 um with a resolution of 0.5 nm, or +/- 160 um with a resolution of 5 nm. Horizontal scan lengths from 80 um up to 10 mm.
Materials Restrictions
(none)
Barrel Asher
| Coral ID: | BarrelEtch |
| Manufacturer: | Glow Research |
| Model: | AutoGlow |
| Lab: | MFF |
| Area: | Lithography and Direct Patterning |
| Manual: | http://coral.engr.washington.edu/manuals/BarrelEtch.pdf |
Description
Barrel asher used to strip resist or other organic films, descum patterned resist, or clean surfaces of residual organics using an isotropic oxygen plasma.
Details
Accomodates substrate from chips up to 100mm diameter wafers.
Materials Restrictions
(none)
Surface Plasmon Resonance
| Coral ID: | Biacore_SPR |
| Lab: | NTUF |
| Manual: | https://depts.washington.edu/ntuf/facility/training.php |
Description
Surface Plasmon Resonance (SPR) biosensor
Details
Kinetic and affinity data (KD, ka, kd), specificity, concentration and thermodynamics data
Materials Restrictions
(none)
X-Ray Diffraction
| Coral ID: | Bruker_D8_XRD |
| Manufacturer: | Bruker AXS |
| Model: | D8 Discover with GADDS |
| Lab: | NTUF |
| Manual: | https://depts.washington.edu/ntuf/facility/training.php |
Description
X-ray diffraction tool for investigation of crystal structures; Advanced XRD with automated Laser-Video alignment system and 2D detector
Details
(none given)
Materials Restrictions
(none)
CO2 Laser
| Coral ID: | CO2-Laser |
| Manufacturer: | Universal Laser |
| Model: | M25 |
| Lab: | MFF |
| Area: | Packaging and Back End |
| Manual: | http://coral.engr.washington.edu/manuals/CO2-Laser.pdf |
Description
Laser cutting of polymer films.
Details
(none given)
Materials Restrictions
(none)
Dimension AFM
| Coral ID: | Dimension-3100 |
| Manufacturer: | Veeco/DI/Bruker |
| Model: | Dimension 3100 |
| Lab: | NTUF |
| Area: | Inspection |
Description
Multifunctional SPM tool; AFM, LFM, MFM, SP/EFM, PFM, Force Measurement, and Liquid Modes
Details
(none given)
Materials Restrictions
(none)
Deep Reactive Ion Etcher
| Coral ID: | DRIE |
| Manufacturer: | Oxford Instruments |
| Model: | ICP 380 |
| Lab: | MFF |
| Area: | Dry Etch |
| Manual: | http://coral.engr.washington.edu/manuals/DRIE.pdf |
Description
Deep Reactive Ion Etch system for etching silicon using a Bosch-etch process of alternating SF6 and C4F8 gases to achieve high etch rate, high aspect ratio structures.
Details
100mm wafers, silicon only. Mask materials SiO2 (150:1 selectivity) or Photoresist (60:1) only. No exposed metal.
Materials Restrictions
Silicon wafers only, with SiO2 or photoresist masks only. No exposed metals. Through-wafer etches require use of a carrier wafer.
E-Beam Lithography
| Coral ID: | EBeam-Lithography |
| Manufacturer: | JEOL |
| Model: | JBX6300FS |
| Lab: | MFF |
| Area: | Lithography and Direct Patterning |
| Manual: | http://ebeam.mff.uw.edu/ |
Description
Direct-write 100 kV Electron Beam Lithography producing feature sizes as small a 10 nm, and layer-to-layer registration ~30 nm m+3s.
Details
Substrates from small chips to 6in wafers. A wide range of beam currents, choice of two objective lenses, and a wide range of resist processes provide significant flexibility for a variety of needs. Sophisticated data preparation software provides advanced functions including full shape and dose proximity correction.
Materials Restrictions
(none)
E-beam Evaporator 1
| Coral ID: | EVAP1-Clean |
| Manufacturer: | CHA |
| Model: | SEC-600 |
| Lab: | MFF |
| Area: | Thin Film Deposition and Growth |
| Manual: | http://coral.engr.washington.edu/manuals/EVAP1.pdf |
Description
EVAP1 is an electron beam evaporator for depositing metal films. It is cryopumped with a base pressure less than 2x10-6 Torr. The system holds 4 crucibles of metal, thus up to 4 metals can be subsequently deposited.
Details
The system has a capacity up to nine 100mm wafers in a planetary holder. Smaller pieces can be held by inserts. Typical evaporation sources are Ti, Au, Cr, Pt, Ag, Al, Pd, Cu, and Ni. Other sources are available. Precious metals (Au, Pt, and Pd) are charged by use. Users are welcome to request new materials and need to work with staff on developing proper recipes.
Materials Restrictions
Only pure metals are recommended. The evaporation process typically does not allow for effective deposition of compound materials. Photoresist-coated substrates are allowed. Inorganic substrates are allowed in the system. Inorganic substrates may be allowed with staff permission.
E-beam Evaporator 2
| Coral ID: | EVAP2 |
| Manufacturer: | CHA |
| Model: | Solution |
| Lab: | MFF |
| Area: | Thin Film Deposition and Growth |
| Manual: | http://coral.engr.washington.edu/manuals/EVAP2.pdf |
Description
The E-beam Evaporator is a metal evaporation system that uses an electron beam to heat the metal sources. The system has 6 pockets for different materials during deposition. Pockets #1 is titanium, pocket #2 is chrome, pocket #3 is gold, pocket #4 is platinum, and pocket #6 is aluminum. he materials are put into crucible liners for better heat uniformity throughout the source material and to allow for easy removal and refilling. The vacuum system is produced via a cryopump as the high vacuum pump. There is a mechanical pump that is capable of roughing the chamber and regenerating the cryopump as needed.
Details
This system has a capacity of up to seven 100mm wafers when using the liftoff fixturing and fifteen 100mm wafers when using the planetary. Holders for smaller pieces are also available. This system is the most automated of our evaporation systems and is capable of producing multilayer stacks without user intervention. Precious metals (Au and Pt) are charged by use. This system also includes a heater so that depositions can be performed at up to 300 C and an ion mill to clean surfaces prior to deposition.
Materials Restrictions
Most substrates are allowed. Consult a staff member prior to new processes on substrates other than glass, quartz, or silicon. Only pure metals are recommended. The evaporation process typically does not allow for effective deposition of compound materials. Photoresist is typically allowed, but ask a staff member prior to performing a new process.
E-beam Evaporator 3
| Coral ID: | EVAP3-Liftoff |
| Manufacturer: | NRC |
| Model: | 3117 |
| Lab: | MFF |
| Area: | Thin Film Deposition and Growth |
| Manual: | http://coral.engr.washington.edu/manuals/EVAP3.pdf |
Description
EVAP3 is an electron beam evaporator for depositing thin metal films. It is diffusion pumped with a base pressure of less than 3x10-6 Torr. The system holds 4 crucibles of metal, thus up 4 metals can be subsequently deposited.
Details
This system has a capacity up to eighteen 100mm wafers in a rotating planetary holder. Smaller pieces can be held by inserts. A liftoff stage holds four 100mm wafers at normal incidence to the evaporation source for optimum deposition for liftoff of fine structures. Many metals are used in this system, including: Al, Al-1%Si, Cu, Ag, Cr, Au, Ni, NiCr, Ti, Pt, Pd, Si, SiO2. Other sources are also available. Please contact the lab for additional information. Precious metals (Au, Pt, and Pd) are charged by use.
Materials Restrictions
Most nonhazardous, nontoxic, nonradioactive materials are allowed in the system--this applies to both substrates and evaporation sources. When starting a new process, contact staff for permission and advice. Users are welcome to request new materials and need to work with staff on developing proper recipes.
EVG Aligner
| Coral ID: | EVG-Aligner |
| Manufacturer: | EVG |
| Model: | 620 |
| Lab: | MFF |
| Area: | Lithography and Direct Patterning |
| Manual: | http://coral.engr.washington.edu/manuals/EVG-Aligner.pdf |
Description
Contact photolithography tool for exposure of 100mm wafers. An optimized process can achieve 2 um line/space patterns with a layer-to-layer registration accuracy about 3 um. Backside alignment is possible using a second set of alignment optics.
Details
Uses 5in square photomasks with 0.090in thickness. Configured for exposure of 100mm wafers; smaller chips can be accomodated using a carrier wafer.
Materials Restrictions
(none)
EVG Bonder
| Coral ID: | EVG-Bonder |
| Manufacturer: | EVG |
| Model: | 501 |
| Lab: | MFF |
| Area: | Packaging and Back End |
| Manual: | http://coral.engr.washington.edu/manuals/EVG-Bonder.pdf |
Description
Thermal compression anodic bonding for Si and glass substrates.
Details
Configured for 100mm wafers.
Materials Restrictions
(none)
Filmetrics F50
| Coral ID: | Filmetrics |
| Manufacturer: | Filmetrics |
| Model: | F50 |
| Lab: | MFF |
| Area: | Device and Structure Characterization |
| Manual: | http://coral.engr.washington.edu/manuals/Filmetrics.pdf |
Description
Optical measurement of thin film layers on various substrates. Uses spectral reflectance to determine film thickness, refractive index, and extinction coefficient by scanning wavelengths from 200 to 1700 nm.
Details
Substrates up to 6in can be mapped automatically.
Materials Restrictions
(none)
ICP-Chlorine
| Coral ID: | ICP-Chlorine |
| Manufacturer: | Oxford |
| Model: | PlasmaLab 100, ICP-180 |
| Lab: | MFF |
| Area: | Dry Etch |
| Manual: | http://coral.engr.washington.edu/manuals/ICP-Chlorine.pdf |
Description
Highly anisotropic Inductively Coupled Plasma (ICP) etching using chlorine-based etch chemistries for etching Silicon, III-V semiconductors, aluminum and chrome. Load-locked for rapid load/unload and high process consistency.
Details
Process gases: BCl3, Cl2, H2, N2, O2, SiCl4, and SF6. A heated stage allows etching at substrates temperatures up to 250 C. 100mm wafers only. Smaller sizes can be accomodated using a 100mm silicon wafer as a carrier wafer.
Materials Restrictions
Metal masks not allowed. No exposed noble metals.
ICP-Fluorine
| Coral ID: | ICP-Fluorine |
| Manufacturer: | Oxford |
| Model: | PlasmaLab 100, ICP-180 |
| Lab: | MFF |
| Area: | Dry Etch |
| Manual: | http://coral.engr.washington.edu/manuals/ICP-Fluorine.pdf |
Description
Highly anisotropic Inductively Coupled Plasma (ICP) etching using fluorine-based etch chemistries. Load-locked for rapid load/unload and high process consistency. An LN2-cooled stage provides cryo-etching capabilities.
Details
Materials etched include Silicon, Silicon Dioxide, Silicon Nitride, and refractory metals including Tungsten, Titanium, Molybdenum, and Niobium. Process gases: C4F8, CHF3, N2, O2, and SF6. 100mm wafers only. Smaller sizes can be accomodated using a 100mm silicon wafer as a carrier wafer.
Materials Restrictions
Metal masks only allowed for etches with a bias voltage <100V. No dirty glass can be etched (<99% SiO2), ie no pyrex, no borosilicate, no soda-lime.
Low-Speed Diamond Saw
| Coral ID: | Isomet-Saw |
| Manufacturer: | Buehler |
| Model: | Isomet |
| Lab: | NTUF |
| Area: | Packaging and Back End |
| Manual: | https://depts.washington.edu/ntuf/facility/training.php |
Description
Slow saw for trimming embeded samples and materials.; Minimize heat during cuts.
Details
(none given)
Materials Restrictions
(none)
JEOL-SEM
| Coral ID: | JEOL-SEM |
| Manufacturer: | JEOL |
| Model: | JSM7400F |
| Lab: | MFF |
| Area: | Device and Structure Characterization |
| Manual: | http://coral.engr.washington.edu/manuals/JEOL-SEM.pdf |
Description
Very high-resolution cold field emission Scanning Electron Microscope (SEM), provides imaging down to a few nm. Conventional, in-lens and backscattered electron detectors are available.
Details
A load-lock allows fast sample exchange and maintains a clean chamber for better high-resolution imaging. A variety of sample holders for mounting substrates from small chips up to 100mm wafers. Tilt angle range depends on substrate size and working distance.
Materials Restrictions
Clean, low-outgassing substrates only. No magnetic samples.
K&S Dicing Saw
| Coral ID: | KS-Saw |
| Manufacturer: | Kulicke & Soffa |
| Model: | 780 |
| Lab: | MFF |
| Area: | Packaging and Back End |
| Manual: | http://coral.engr.washington.edu/manuals/KS-Saw.pdf |
Description
A dicing saw for wafers and other substrates. Blade thickness: Typically 15 mils. Standard 100mm hub used to hold dicing blade.
Details
(none given)
Materials Restrictions
(none)
LPCVD-Nitride
| Coral ID: | LPCVD-Nitride |
| Manufacturer: | Canary |
| Lab: | MFF |
| Area: | Thin film Deposition and Growth |
| Manual: | http://coral.engr.washington.edu/manuals/LPCVD-Nitride.pdf |
Description
Low Pressure Chemical Vapor Despoition growth of low-stress silicon nitride on 100mm silicon wafers.
Details
(none given)
Materials Restrictions
No metals. Wafers must be cleaned using RCA clean within 2 hours of loading.
Multimode AFM/STM
| Coral ID: | Multimode_AFM-STM |
| Manufacturer: | Veeco/DI/Bruker |
| Model: | Multimode |
| Lab: | NTUF |
| Area: | Inspection |
Description
The digital AFM, operated with a Nanoscope IIIa controller, can perform the full; AFM, MFM, LFM, STM and liquid modes
Details
(none given)
Materials Restrictions
(none)
Nanospec
| Coral ID: | Nanospec |
| Manufacturer: | Nanometrics |
| Model: | 210 |
| Lab: | MFF |
| Area: | Device and Structure Characterization |
| Manual: | http://coral.engr.washington.edu/manuals/Nanospec.pdf |
Description
Single-point spectral reflectance to measure film thickness and refractive index.
Details
(none given)
Materials Restrictions
(none)
Nikon
| Coral ID: | Nikon |
| Manufacturer: | Optiphot |
| Model: | 200 |
| Lab: | MFF |
| Area: | Device and Structure Characterization |
| Manual: | http://coral.engr.washington.edu/manuals/Nikon.pdf |
Description
High-resolution optical microscope including dark-field, polarized and Normarski interference imaging. LED light sources for both reflected and transmitted illumination, and a CMOS camera for image capture.
Details
(none given)
Materials Restrictions
(none)
Oxford OpAL ALD
| Coral ID: | Oxford-OpAL-ALD |
| Manufacturer: | Oxford Instruments |
| Model: | Plasmalab 80Plus OpAL ALD |
| Lab: | MFF |
| Area: | Thin Film Deposition and Growth |
| Manual: | http://coral.engr.washington.edu/manuals/Oxford-OpAL-ALD.pdf |
Description
This atomic layer deposition (ALD) system deposits layers of material monolayer by monolayer. It has been used recently to deposit Al2O3 and HfO2.
Details
This system provides precise growth control over thin films. Layers have been used as dielectrics and mask layers. Processes can be run in either the plasma-ALD or thermal-ALD modes. While aluminum and halfnium oxides have been run recently, other precursors are available. Run temperatures range from 100C to 300C.
Materials Restrictions
This system can accommodate up to 200mm wafers. The chamber opens for loading so numerous smaller pieces can be arranged inside the system.
P-15 Profilometer
| Coral ID: | P15 |
| Manufacturer: | Tencor |
| Model: | P-15 |
| Lab: | MFF |
| Area: | Device and Structure Characterization |
| Manual: | http://coral.engr.washington.edu/manuals/P15.pdf |
Description
A surface profilometer for physical measurement of topography on wafers. Can program a sequence of locations to scan, providing 2-D and pseudo-3-D measurement of topography, as well as calcuation of film stress by before & after measurements.
Details
(none given)
Materials Restrictions
(none)
Plasma Enhanced CVD
| Coral ID: | PECVD |
| Manufacturer: | Oxford Instruments |
| Model: | Plasma Lab 100 |
| Lab: | MFF |
| Area: | Thin film Deposition and Growth |
| Manual: | http://coral.engr.washington.edu/manuals/PECVD.pdf |
Description
Plasma-Enhanced Chemical Vapor Deposition (PECVD) of Silicon Dioxide, Silicon Nitride, Silicon Oxynitride and amorphous silicon. Dual-frequency power supply provides enhanced stress control in nitride films.
Details
Wafers up to 8in. Smaller chips can be accomodated using a 100mm silicon wafer as a carrier wafer.
Materials Restrictions
No exposed metal or polymer (ie, resist) allowed.
Diener Plasma Cleaner
| Coral ID: | Plasma-Cleaner |
| Manufacturer: | Diener Electronic |
| Model: | Fempto |
| Lab: | NTUF |
| Area: | ASH |
Description
Etch photoresist and modify surface; Large chamber
Details
(none given)
Materials Restrictions
(none)
Renishaw Raman Confocal
| Coral ID: | Renishaw-Raman |
| Manufacturer: | Renishaw |
| Model: | InVia |
| Lab: | NTUF |
Description
Raman spectroscopy for molecular characterization.; 514 nm and 784 nm lasers
Details
(none given)
Materials Restrictions
(none)
SCS Spin Coater #1
| Coral ID: | SCS-SpinCoater-1 |
| Manufacturer: | Specialty Coating Systems |
| Model: | 6700 |
| Lab: | NTUF |
Description
Spin thin films on substrate.
Details
(none given)
Materials Restrictions
PMMA only
Sirion SEM
| Coral ID: | Sirion-SEM |
| Manufacturer: | FEI |
| Model: | Sirion |
| Lab: | NTUF |
| Area: | Inspection |
Description
Field Emission SEM with EDS, EBL and BSD capabilities; Xmax80 for fast X-ray mapping of large areas.
Details
(none given)
Materials Restrictions
(none)
Lesker Sputter
| Coral ID: | Sputter-Lesker |
| Manufacturer: | Lesker |
| Model: | Lab 18 |
| Lab: | MFF |
| Area: | Thin film Deposition and Growth |
| Manual: | http://coral.engr.washington.edu/manuals/Sputter-Lesker.pdf |
Description
This cryo pumped system is used for sputter deposition of films, with DC, RF, and pulsed DC power supplies. Targets include: Al, Ti, Au, Ti/W, Ni, ZnO, ITO, Nb, Cr, and Ni/Cr.
Details
Three sample holders are available for the system. There are holders for both 6in and 100mm wafers, plus a reconfigurable small-parts holder. Small parts must be of similar thickness to a wafer. Additional holders for specific samples can be fabricated.
Materials Restrictions
Organic substrates require staff review and permission prior to use. Photoresists are allowed in the system.
Magnetron Sputter System
| Coral ID: | Sputter-Oxford |
| Manufacturer: | Oxford Instruments |
| Model: | System 400 |
| Lab: | MFF |
| Area: | Thin film Deposition and Growth |
| Manual: | http://coral.engr.washington.edu/manuals/Sputter-Oxford.pdf |
Description
The Oxford System 400 is a 4 target, multi wafer, DC Magnatron and RF sputter deposition system.
Details
(none given)
Materials Restrictions
(none)
Transmission Electron Microscope
| Coral ID: | Tecnai-TEM |
| Manufacturer: | FEI |
| Model: | Tecnai G2 F20 |
| Lab: | NTUF |
Description
200 kV scanning transmission electron microscope (S/TEM), EDAX, and tomography
Details
(none given)
Materials Restrictions
(none)
Tegal Oxide Etcher
| Coral ID: | Tegal |
| Manufacturer: | Tegal |
| Model: | 903e |
| Lab: | MFF |
| Area: | Dry Etch |
| Manual: | http://coral.engr.washington.edu/manuals/Tegal.pdf |
Description
Plasma etch system to etch SiO2 at high rates.
Details
100mm silicon wafers only.
Materials Restrictions
(none)
Reactive Ion Etcher
| Coral ID: | Trion |
| Manufacturer: | Trion |
| Model: | Phantom |
| Lab: | MFF |
| Area: | Dry Etch |
| Manual: | http://coral.engr.washington.edu/manuals/Trion.pdf |
Description
A parallel-plate Reactive Ion Etch (RIE) system. Open load for flexible substrate handling. Etch gases are: SF6, CHF3, and O2.
Details
Any substrates and materials are allowed.
Materials Restrictions
(none)
Reactive Ion Etcher
| Coral ID: | Vision-RIE |
| Manufacturer: | Vision |
| Lab: | MFF |
| Area: | Dry Etch |
| Manual: | http://coral.engr.washington.edu/manuals/Vision-RIE.pdf |
Description
A parallel-plate Reactive Ion Etch (RIE) system. Open load for flexible substrate handling. Etch gases are: Ar, CF4, CHF3, N2, O2, and SF6.
Details
Open load, so any size substrates are allowed.
Materials Restrictions
No metal films, and no dirty glasses (<99% SiO2) allowed.
Woollam Spectroscopic Ellipsometer
| Coral ID: | Woollam_Ellipsometer |
| Manufacturer: | Woollam |
| Model: | M-2000 |
| Lab: | NTUF |
| Manual: | https://depts.washington.edu/ntuf/facility/training.php |
Description
Used for determination of thicknesses and optical parameters of thin films and multilayers; Spectral range: 210-1700nm; Spot size: normal > 1.5 mm, focused <150 μm; Sample mapping; Heating option: to 300 °C
Details
(none given)
Materials Restrictions
(none)
Non-contact Optical Profiler
| Coral ID: | Wyko |
| Manufacturer: | Wyco |
| Model: | NT3300 |
| Lab: | MFF |
| Area: | Device and Structure Characterization |
| Manual: | http://coral.engr.washington.edu/manuals/Wyko.pdf |
Description
Non contact, highly accurate, 3D surface topography measurements using optical interference.
Details
(none given)
Materials Restrictions
(none)
Laser Confocal Microscope
| Coral ID: | Zeiss-LSM |
| Manufacturer: | Zeiss |
| Model: | LSM 510 |
| Lab: | NTUF |
| Area: | Inspection |
Description
Confocal Microscope for optical section of whole specimens.; Excitation at 458,477,488,514,543, and 643nm
Details
(none given)
Materials Restrictions
(none)
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