UW NNIN Site - Tool List


ABM Contact Aligner

Coral ID:ABM-Aligner
Manufacturer: AB-M
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/ABM-Aligner.pdf

Description

Contact photolithography exposure tool for 100mm wafers. An optimized process can achieve 2 um line/space patterns with a layer-to-layer registration accuracy about 3 um.

Details

(none given)

Materials Restrictions

Uses 5in or 7in square photomasks with 0.090in thickness. Configured for exposure of 100mm wafers; smaller chips can be accomodated using a carrier wafer.


AVIV FDS

Coral ID:FDS
Lab:BIOCOR
Manual:https://coral.engr.washington.edu/

Description

Fluorescence AUC Instrument

Details

(none given)

Materials Restrictions

(none)


Alpha Step Profilometer

Coral ID:Alphastep
Manufacturer: Tencor
Model:Alpha Step 200
Lab:WNF
Area:Device and Structure Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/alphastep.pdf

Description

Stylus profilometer for measuring vertical step heights in a wide range of materials.

Details

Vertical ranges of +/- 16 um with a resolution of 0.5 nm, or +/- 160 um with a resolution of 5 nm. Horizontal scan lengths from 80 um up to 10 mm.

Materials Restrictions

(none)


Barrel Asher

Coral ID:BarrelEtch
Manufacturer: Glow Research
Model:AutoGlow
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/AG_barrel_etch.pdf

Description

Barrel asher used to strip resist or other organic films, descum patterned resist, or clean surfaces of residual organics using an isotropic oxygen plasma.

Details

Accomodates substrate from chips up to 100mm diameter wafers.

Materials Restrictions

(none)


CO2 Laser

Coral ID:WNF-M20-Laser
Manufacturer: Universal Laser
Model:M20
Lab:WNF
Area:Packaging and Back End
Manual:https://coral.engr.washington.edu/

Description

Laser cutting of polymer films.

Details

(none given)

Materials Restrictions

(none)


Canon Stepper

Coral ID:Canon-5X-Stepper
Manufacturer: Canon
Model:FPA-3000 i4
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/

Description

Non-contact photolithography exposure tool for 100mm and 200mm wafers. An optimized process can achieve 350nm features with a stepping accuracy of 40nm.

Details

Wafer Size: 8” or 4” SEMI Standard, JEIDA,Notch / Flat | Reticle: Standard Size 6" | Projection Magnification: 5X | Exposure Light: 365nm | Intensity: >6500W/m2 | Uniformity: < 1.0% | Field Size: 22x26mm | Masking Blade: Blades Independent (0.4X0.4mm~26X26mm on wafer) | Resolution: 0.35µm | Depth of Focus: >1.0µm | Image Field Deviation: <0.5µm | Distortion: <±0.05µm | Alignment Lighting Source: He-Ne Laser, Broad Band(Halogen Lamp) | Alignment System: Off Axis TTL | Alignment Mode: AGA | Step Accuracy: <0.04µm (3sigma) | Scaling: <±0.5ppm | Orthogonality: <±0.5ppm | Reticle Rotation Accuracy: <±0.015µm | Cleanness: Class 1(>0.1µm)

Materials Restrictions

(none)


Coral ID:Computer-G42B-XRD-AFM
Lab:MAF
Manual:https://coral.engr.washington.edu/

Description

Windows XP computer on the desk in G42B. This computer has software for offline analysis of XRD, AFM, Ellipsometry, and TEM data.

Details

(none given)

Materials Restrictions

(none)


Critical Point Drier

Coral ID:CPD--Tousimis-SamDri-780
Manufacturer: Tousimis
Model:SamDri-780
Lab:MAF
Area:Other
Manual:https://coral.engr.washington.edu/

Description

Instrument that performs dehydration of biological tissue or other hydrated materials prior to high-vacuum SEM characterization. Ethanol in the sample is exchanged for liquid CO2 then the vessel is heated under pressure beyond the CO2 critical point (1100psi at 32C). A typical sample of cells on coverglass requires about 90 minutes to properly dry. Solid tissues can take significantly longer.

Details

Chamber is a vertical cylinder 2.9cm diameter and 9cm tall.

Materials Restrictions

(none)


Deep Reactive Ion Etcher

Coral ID:DRIE
Manufacturer: Oxford Instruments
Model:ICP 380
Lab:WNF
Area:Dry Etch
Manual:https://coral.engr.washington.edu/upload/manuals/DRIE.pdf

Description

Deep Reactive Ion Etch system for etching silicon using a Bosch-etch process of alternating SF6 and C4F8 gases to achieve high etch rate, high aspect ratio structures.

Details

100mm wafers, silicon only. Mask materials SiO2 (150:1 selectivity) or Photoresist (60:1) only. No exposed metal.

Materials Restrictions

Silicon wafers only, with SiO2 or photoresist masks only. No exposed metals. Through-wafer etches require use of a carrier wafer.


Dektak Profilometer

Coral ID:Profilometer--Bruker-DektakXT
Manufacturer: Bruker
Model:OM-DektakXT
Lab:MAF
Area:Thin Film and Materials Characterization
Manual:https://coral.engr.washington.edu/

Description

Profilometer for measuring sub-nanoscale to millimeter scale film thicknesses, roughness, and thin film tensile and compressive stressed.

Details

Diamond stylus with 2 um radius.

Materials Restrictions

(none)


Coral ID:Diffusion-Furnace
Manufacturer: Expertech
Model:CTR200
Lab:WNF
Area:Thin Film Processing
Manual:https://coral.engr.washington.edu/upload/manuals/Furnace SOP.pdf

Description

Multiple tubes for (a) Diffusion/drive for annealing and dopant drive, and (2) wet or dry oxidation.

Details

(none given)

Materials Restrictions

(none)


Dimension AFM

Coral ID:AFM--Bruker-Dimension-3100
Manufacturer: Veeco/DI/Bruker
Model:Dimension 3100
Lab:MAF
Area:Inspection
Manual:https://coral.engr.washington.edu/

Description

Multifunctional SPM tool; AFM, LFM, MFM, SP/EFM, PFM, Force Measurement, and Liquid Modes

Details

(none given)

Materials Restrictions

(none)


Dimple Grinder

Coral ID:Dimple-Grinder--Fischione-200
Manufacturer: Fischione
Model:200
Lab:MAF
Manual:https://coral.engr.washington.edu/

Description

Either 1 or double sided dimple grinder for preparation of ion milling samples for TEM

Details

(none given)

Materials Restrictions

Contact staff for training and qualification


Disco Wafer Dicer

Coral ID:Disco-Saw
Manufacturer: Disco America
Model:DAD321
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/201308_Disco_SOP.pdf

Description

Wafer dicing capable of 150mm diameter wafers and smaller.

Details

(none given)

Materials Restrictions

(none)


Coral ID:Dual-Beam-SEM-FIB--FEI-XL830
Manufacturer: FEI
Model:Altura XL830
Lab:MAF
Area:Inspection
Manual:https://coral.engr.washington.edu/upload/manuals/DualBeamManual_v0115.pdf

Description

Dual-beam SEM-FIB

Details

The XL830 workstation is a single platform for both hi-resolution electron/ion imaging and site specific milling for a variety of applications. It is equipped with a field-emission SEM column and a gallium focused ion beam (FIB). The electron beam allows observation of samples while the FIB accomplishes nano-machining of samples and devices for device editing, failure analysis, and sublayer observation. Detectors include Through Lens Detector (TLD), sTEM, and Continuous Dynode Electron Multiplier (CDEM) for secondary electron, backscattered electron, and secondary ion imaging. A stationary microprobe is used for extraction of milled TEM lamella samples from wafer substrates. Beam chemistries include enhanced Si/SiOx etch and site specific platinum deposition.

Materials Restrictions

Samples must be conductive and vacuum safe to 10^-8 mTorr. Chamber will accommodate an 8" wafer or multiple smaller pin-mount stubs. Mounted sample height must be below 8mm.


E-Beam Lithography

Coral ID:EBeam-Lithography
Manufacturer: JEOL
Model:JBX6300FS
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/

Description

Direct-write 100 kV Electron Beam Lithography capable of feature sizes as small as 10 nm, and layer-to-layer registration better than ~30 nm m+3s.

Details

Substrates from small chips to 150mm wafers. A wide range of beam currents, choice of two objective lenses, and a wide range of resist processes provide significant flexibility for a variety of needs. Sophisticated data preparation software provides advanced functions including full shape and dose proximity correction.

Materials Restrictions

(none)


E-beam Evaporator 1

Coral ID:EVAP1-Clean
Manufacturer: CHA
Model:SEC-600
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/EVAP1 - SOP.pdf

Description

EVAP1 is an electron beam evaporator for depositing metal films. It is cryopumped with a base pressure less than 2x10-6 Torr. The system holds 4 crucibles of metal, thus up to 4 metals can be subsequently deposited.

Details

The system has a capacity up to nine 100mm wafers in a planetary holder. Smaller pieces can be held by inserts. Typical evaporation sources are Ti, Au, Cr, Pt, Ag, Al, Pd, Cu, and Ni. Other sources are available. Precious metals (Au, Pt, and Pd) are charged by use. Users are welcome to request new materials and need to work with staff on developing proper recipes. The distance from the evaporation source to the wafer holder is about 19.5 inches. Serial Number: 11199

Materials Restrictions

Only pure metals are recommended. The evaporation process typically does not allow for effective deposition of compound materials. Photoresist-coated substrates are allowed. Inorganic substrates are allowed in the system. Organic substrates may be allowed with staff permission.


E-beam Evaporator 2

Coral ID:EVAP2
Manufacturer: CHA
Model:Solution
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/EVAP2 - SOP.pdf

Description

The E-beam Evaporator is a metal evaporation system that uses an electron beam to heat the metal sources. The system has 6 pockets for different materials during deposition. Pockets #1 is titanium, pocket #2 is chrome, pocket #3 is gold, pocket #4 is platinum, pocked #5 is palladium or copper, and pocket #6 is aluminum. The materials are put into crucible liners for better heat uniformity throughout the source material and to allow for easy removal and refilling. The vacuum system is produced via a cryopump as the high vacuum pump. There is a mechanical pump that is capable of roughing the chamber and regenerating the cryopump as needed.

Details

This system has a capacity of up to seven 100mm wafers when using the liftoff fixturing and fifteen 100mm wafers when using the planetary. It can also hold 3 200mm wafers in a planetary configuration. Holders for smaller pieces are also available. This system is the most automated of our evaporation systems and is capable of producing multilayer stacks without user intervention. Precious metals (Au, Pd, and Pt) are charged by use. This system also includes a heater so that depositions can be performed at up to 300 C and an ion mill to clean surfaces prior to deposition. The distance from the evaporation source to the wafer holder is about 14.5 inches. System #6629 Solution

Materials Restrictions

Most substrates are allowed. Consult a staff member prior to new processes on substrates other than glass, quartz, or silicon. Only pure metals are recommended. The evaporation process typically does not allow for effective deposition of compound materials. Photoresist is typically allowed, but ask a staff member prior to performing a new process.


E-beam Evaporator 3

Coral ID:EVAP3-Liftoff
Manufacturer: NRC
Model:3117
Lab:WNF
Area:Thin Film Deposition and Growth
Manual:https://coral.engr.washington.edu/upload/manuals/EVAP3 - SOP.pdf

Description

EVAP3 is an electron beam evaporator for depositing thin metal films. It is diffusion pumped with a base pressure of less than 3x10-6 Torr. The system holds 4 crucibles of metal, thus up 4 metals can be subsequently deposited.

Details

This system has a capacity up to eighteen 100mm wafers in a rotating planetary holder. Smaller pieces can be held by inserts. A liftoff stage holds four 100mm wafers at normal incidence to the evaporation source for optimum deposition for liftoff of fine structures. Many metals are used in this system, including: Al, Al-1%Si, Cu, Ag, Cr, Au, Ni, NiCr, Ti, Pt, Pd, Si, SiO2. Other sources are also available. Please contact the lab for additional information. Precious metals (Au, Pt, and Pd) are charged by use. The distance from the evaporation source to the wafer holder is about 19.5 inches. Serial Number: 75685-01

Materials Restrictions

Most nonhazardous, nontoxic, nonradioactive materials are allowed in the system--this applies to both substrates and evaporation sources. When starting a new process, contact staff for permission and advice. Users are welcome to request new materials and need to work with staff on developing proper recipes.


EVG Aligner

Coral ID:EVG-Aligner
Manufacturer: EVG
Model:620
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/EVG-Aligner.pdf

Description

Contact photolithography tool for exposure of 100mm wafers. An optimized process can achieve 2 um line/space patterns with a layer-to-layer registration accuracy about 3 um. Backside alignment is possible using a second set of alignment optics.

Details

Uses 5in square photomasks with 0.090in thickness. Configured for exposure of 100mm wafers; smaller chips can be accomodated using a carrier wafer.

Materials Restrictions

(none)


EVG Bonder

Coral ID:EVG-Bonder
Manufacturer: EVG
Model:501
Lab:WNF
Area:Packaging and Back End
Manual:https://coral.engr.washington.edu/

Description

Thermal compression anodic bonding for Si and glass substrates.

Details

Configured for 100mm wafers.

Materials Restrictions

(none)


Energy Dispersive X-ray Spectroscopy

Coral ID:EDS--Dual-Beam
Manufacturer: Oxford
Model:X-max
Lab:MAF
Area:Inspection
Manual:https://coral.engr.washington.edu/upload/manuals/Altura EDS SOP.pdf

Description

The Oxford Energy Dispersed X-ray Spectrometer (EDX) system allows ultra-fast X-ray mapping with 125eV resolution at Mn-Ka. Post-processing features are available on the Coral PC Aztec software.

Details

(none given)

Materials Restrictions

(none)


Energy Dispersive X-ray Spectroscopy

Coral ID:EDS--SEM
Lab:MAF
Area:Inspection
Manual:https://coral.engr.washington.edu/upload/manuals/Sirion EDS SOP.pdf

Description

The Oxford Energy Dispersed X-ray Spectrometer (EDX) system allows ultra-fast X-ray mapping with 127eV resolution at Mn-Ka. Post-processing features of the Aztec software include "TrueLine" and "TrueMap" automatic element deconvolution and "QuantLine" quantitative linescan.

Details

(none given)

Materials Restrictions

(none)


Filmetrics F50

Coral ID:Filmetrics
Manufacturer: Filmetrics
Model:F50
Lab:WNF
Area:Device and Structure Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/FilmetricsUserInstructions_V1.0.pdf

Description

Optical measurement of thin film layers on various substrates. Uses spectral reflectance to determine film thickness, refractive index, and extinction coefficient by scanning wavelengths from 200 to 1700 nm.

Details

Substrates up to 6in can be mapped automatically.

Materials Restrictions

(none)


Four Dimensions Four-Point Probe Model 280 SI

Coral ID:4-PointProbe
Manufacturer: Four Dimensions
Model:280 SI
Lab:WNF
Area:Thin Film and Materials Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/Four-Point Probe SOP.pdf

Description

The Four Dimensions Four-Point Probe Model 280 SI is capable for making sheet resistivity measurements on various samples. It can map the sheet resistance of samples up to 8 inches in diameter. There are standard maps in the system and custom maps can be created.

Details

The four-point probe is used to measure conductivity of thin films and bulk material. A current is applied between the outer two probes and a voltage drop is measured between the middle two probes. This system is typically used to measure sheet resistivity, if the thickness of the conductive layers is known, sheet resistivity can be converted to bulk resistivity

Materials Restrictions

Make sure samples are dry and clean before loading them into the four-point probe. For samples thicker than a wafer, make sure the probe head will clear the sample.


Coral ID:GDOES--Horiba-Profiler-2
Manufacturer: Horiba
Model:Profiler 2
Lab:MAF
Area:Thin Film and Materials Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/Horiba_GD_Profiler SOP 150702.docx

Description

The Horiba GD-Profiler 2 gives rapid depth-resolved elemental analysis with down to 5 nm resolution. The instrument uses an Ar plasma to sputter a 2 mm or 4 mm diameter crater into the sample, and measures uses atomic emission spectroscopy to identify the material being sputtered away. The sputtering rate is variable, but is approximately 10 microns per minute. Detectable elements are highlighted in the image at right.

Details

(none given)

Materials Restrictions

(none)


Gatan Solarus Plasma Cleaner

Coral ID:Plasma-Cleaner--Gatan-Solarus
Manufacturer: Gatan
Model:Solarus
Lab:MAF
Manual:https://coral.engr.washington.edu/

Description

Plasma clean and glow-discharge samples or TEM holders.

Details

Top down chamber for "large" bulky samples or TEM grids; Two side mount chambers for TEM holders.

Materials Restrictions

Staff training and qualification required for use. Samples must be approved for use in the chambers.


Headway Spin Coater

Coral ID:SPIN5-Headway
Manufacturer: Headway
Model:PWM32
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/

Description

Manual spin coater with vacuum chucks available for pieces from a few mm up to 150 mm wafers. Typically used for thick resists or specialty materials, such as SU-8 or LOR.

Details

(none given)

Materials Restrictions

(none)


Heidelberg Mask Writer

Coral ID:Heidelberg-MicroPG-101
Manufacturer: Heidelberg Instruments
Model:uPG 101
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/201403 Heidelberg uPG101 Mask Writer.pdf

Description

An extremely economical and easy to use micro pattern generator for low volume mask making and direct writing applications

Details

(none given)

Materials Restrictions

Allows substrate between 50-125mm, no thicker than 6mm, and surface roughness less than or equal to +/- 20um.


ICP-Chlorine

Coral ID:ICP-Chlorine
Manufacturer: Oxford
Model:PlasmaLab 100, ICP-180
Lab:WNF
Area:Dry Etch
Manual:https://coral.engr.washington.edu/upload/manuals/ICP3-Cl-Oxford_UserManual_v1.pdf

Description

Highly anisotropic Inductively Coupled Plasma (ICP) etching using chlorine-based etch chemistries for etching Silicon, III-V semiconductors, aluminum and chrome. Load-locked for rapid load/unload and high process consistency.

Details

Process gases: BCl3, Cl2, H2, N2, O2, SiCl4, and SF6. A heated stage allows etching at substrates temperatures up to 250 C. 100mm wafers only. Smaller sizes can be accomodated using a 100mm silicon wafer as a carrier wafer.

Materials Restrictions

Metal masks not allowed. No exposed noble metals.


ICP-Fluorine

Coral ID:ICP-Fluorine
Manufacturer: Oxford
Model:PlasmaLab 100, ICP-180
Lab:WNF
Area:Dry Etch
Manual:https://coral.engr.washington.edu/upload/manuals/ICP2-F-Oxford_UserManual_v4.pdf

Description

Highly anisotropic Inductively Coupled Plasma (ICP) etching using fluorine-based etch chemistries. Load-locked for rapid load/unload and high process consistency. An LN2-cooled stage provides cryo-etching capabilities.

Details

Materials etched include Silicon, Silicon Dioxide, Silicon Nitride, and refractory metals including Tungsten, Titanium, Molybdenum, and Niobium. Process gases: C4F8, CHF3, N2, O2, and SF6. 100mm wafers only. Smaller sizes can be accomodated using a 100mm silicon wafer as a carrier wafer.

Materials Restrictions

Metal masks only allowed for etches with a bias voltage <100V. No dirty glass can be etched (<99% SiO2), ie no pyrex, no borosilicate, no soda-lime.


Isothermal Titration Calorimeter

Coral ID:AUTOITC200
Manufacturer: Microcal
Model:AutoITC200
Lab:BIOCOR
Manual:https://coral.engr.washington.edu/

Description

Measures heat of binding, Kd, stoichiometry, Entropy and Free energy of binding

Details

(none given)

Materials Restrictions

(none)


JEOL-SEM

Coral ID:JEOL-SEM
Manufacturer: JEOL
Model:JSM7400F
Lab:WNF
Area:Device and Structure Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/JSM7400F_SEM_user_instructions_1.5.pdf

Description

Very high-resolution cold field emission Scanning Electron Microscope (SEM), provides imaging down to a few nm. Conventional, in-lens and backscattered electron detectors are available.

Details

A load-lock allows fast sample exchange and maintains a clean chamber for better high-resolution imaging. A variety of sample holders for mounting substrates from small chips up to 100mm wafers. Tilt angle range depends on substrate size and working distance.

Materials Restrictions

Clean, low-outgassing substrates only. No magnetic samples.


Laser Confocal Microscope

Coral ID:Confocal-Microscope--Zeiss-LSM-510
Manufacturer: Zeiss
Model:LSM 510
Lab:MAF
Area:Inspection
Manual:https://coral.engr.washington.edu/

Description

Confocal Microscope for optical section of whole specimens.; Excitation at 458,477,488,514,543, and 643nm

Details

(none given)

Materials Restrictions

Currently none


Leica Microscope

Coral ID:Leica
Manufacturer: Leica / Reichert
Model:Polylite 88
Lab:WNF
Area:Inspection
Manual:https://coral.engr.washington.edu/

Description

General-purpose wafer microscope with digital camera.

Details

(none given)

Materials Restrictions

(none)


Leitz Optical Microscope

Coral ID:Leitz
Manufacturer: Leitz
Lab:WNF
Area:Inspection
Manual:https://coral.engr.washington.edu/

Description

Older, bare-bones microscope for quick, simple inspection.

Details

(none given)

Materials Restrictions

(none)


Lesker Sputter

Coral ID:Sputter-Lesker
Manufacturer: Lesker
Model:Lab 18
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/LeskerSputter - SOP.pdf

Description

This cryo pumped system is used for sputter deposition of films, with DC, RF, and pulsed DC power supplies. Targets materials include: Al, Ti, Au, Ti/W, Ni, ZnO, ITO, Nb, Cr, Cu, Ir, and Ni/Cr.

Details

Three sample holders are available for the system. There are holders for both 6in and 100mm wafers, plus a reconfigurable small-parts holder. Small parts must be of similar thickness to a wafer. Additional holders for specific samples can be fabricated.

The system has four power supplies. Power supply 1 (1500W max, DC) can be connected to guns 1, 2, 3, and 4. Power supply 4 (600W max, RF) can be connected to all five guns. Power supply 5 (1500W max, DC/pulsed DC) connects only to gun 5. Power supply 6 (100W max, RF) is used to bias the substrate. Only one power supply can connected to each gun at one time. Up to three guns can be sputtering at the same time if the guns are chosen carefully e.g. Gun 1 (DC), Gun 3 (RF), Gun 5 (DC) could be used for cosputtering.

Radio frequency (RF) supplies are used to counteract charge buildup that occurs on nonconducting targets. This is required for most oxides and nitrides used in the system. Conductive samples can be sputtered using an RF supply, but tend to sputter more slowly than with DC supplies.

Materials Restrictions

Organic substrates require staff review and permission prior to use. Photoresists are allowed in the system. Target placement must be reserved in advance by contacting darick@uw.edu. The target schedule is available here: http://goo.gl/fd0Gbh


Low-Speed Diamond Saw

Coral ID:Slow-Saw--Buehler-Isomet
Manufacturer: Buehler
Model:Isomet
Lab:MAF
Area:Packaging and Back End
Manual:https://depts.washington.edu/ntuf/facility/training.php

Description

Slow saw for trimming embeded samples and materials.; Minimize heat during cuts.

Details

(none given)

Materials Restrictions

(none)


Coral ID:Misc-MolES-G42
Lab:MAF
Manual:https://coral.engr.washington.edu/

Description

This is a pseudo-instrument representing "small tools in MolES G42".

Details

(none given)

Materials Restrictions

(none)


Nanoimprinting

Coral ID:Nanoimprint
Manufacturer: Nanonex
Model:NX-B100
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/

Description

Thermal nanoimprinting of substrates up to 75mm.

Details

(none given)

Materials Restrictions

(none)


Nanospec

Coral ID:Nanospec
Manufacturer: Nanometrics
Model:210
Lab:WNF
Area:Thin Film and Materials Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/Nanospec.pdf

Description

Single-point spectral reflectance to measure film thickness and refractive index.

Details

(none given)

Materials Restrictions

(none)


Nikon

Coral ID:Nikon
Manufacturer: Optiphot
Model:200
Lab:WNF
Area:Inspection
Manual:https://coral.engr.washington.edu/upload/manuals/201309 Nikon Microscope.pdf

Description

High-resolution optical microscope including dark-field, polarized and Normarski interference imaging. LED light sources for both reflected and transmitted illumination, and a CMOS camera for image capture.

Details

(none given)

Materials Restrictions

(none)


Non-contact Optical Profiler

Coral ID:Wyko
Manufacturer: Wyco
Model:NT3300
Lab:WNF
Area:Device and Structure Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/Wyko.pdf

Description

Non contact, highly accurate, 3D surface topography measurements using optical interference.

Details

(none given)

Materials Restrictions

(none)


Oxford OpAL ALD

Coral ID:Oxford-OpAL-ALD
Manufacturer: Oxford Instruments
Model:Plasmalab 80Plus OpAL ALD
Lab:WNF
Area:Thin Film Deposition and Growth
Manual:https://coral.engr.washington.edu/upload/manuals/Oxford OpAL ALD SOP.pdf

Description

This atomic layer deposition (ALD) system deposits layers of material monolayer by monolayer. It has been used recently to deposit Al2O3 and HfO2.

Details

This system provides precise growth control over thin films. Layers have been used as dielectrics and mask layers. Processes can be run in either the plasma-ALD or thermal-ALD modes. While aluminum and halfnium oxides have been run recently, other precursors are available. Run temperatures range from 100C to 300C.

Materials Restrictions

This system can accommodate up to 200mm wafers. The chamber opens for loading so numerous smaller pieces can be arranged inside the system.


P-15 Profilometer

Coral ID:P15
Manufacturer: Tencor
Model:P-15
Lab:WNF
Area:Device and Structure Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/P15.pdf

Description

A surface profilometer for physical measurement of topography on wafers. Can program a sequence of locations to scan, providing 2-D and pseudo-3-D measurement of topography, as well as calcuation of film stress by before & after measurements.

Details

(none given)

Materials Restrictions

(none)


Plasma Enhanced CVD

Coral ID:PECVD1-Oxford
Manufacturer: Oxford Instruments
Model:Plasma Lab 100
Lab:WNF
Manual:https://coral.engr.washington.edu/upload/manuals/PECVD1-SOP.pdf

Description

Plasma-Enhanced Chemical Vapor Deposition (PECVD) of Silicon Dioxide, Silicon Nitride, Silicon Oxynitride and amorphous silicon. Dual-frequency power supply provides enhanced stress control in nitride films.

Details

Wafers up to 8in. Smaller chips can be accomodated using a 100mm silicon wafer as a carrier wafer.

Materials Restrictions

Samples going into the chamber must not contaminate the chamber or contain materials that will decompose at 350C.


Coral ID:Plasma-Cleaner--Diener-Femto
Manufacturer: Diener
Model:Femto
Lab:MAF
Manual:https://coral.engr.washington.edu/

Description

Large plasma cleaner

Details

(none given)

Materials Restrictions

(none)


Coral ID:Pulsed-CVD
Manufacturer: Altatech
Model:AltaCVD
Lab:WNF
Area:Thin Film Processing
Manual:https://coral.engr.washington.edu/

Description

Pulsed CVD of metal, metallic barrier, metal-oxide and films. Currently setup for CVD TaN/Cu plating liners.

Details

(none given)

Materials Restrictions

(none)


Rapid Thermal Annealer - Clean

Coral ID:RTA-Clean
Manufacturer: Allwin32
Model:AccuThermo AW 610
Lab:WNF
Area:Thin Film Processing
Manual:https://coral.engr.washington.edu/

Description

Rapid thermal annealer

Details

(none given)

Materials Restrictions

(none)


Reactive Ion Etcher

Coral ID:Vision-RIE
Manufacturer: Vision
Lab:WNF
Area:Dry Etch
Manual:https://coral.engr.washington.edu/upload/manuals/RIE1-Vision_UserManual_v2.pdf

Description

A parallel-plate Reactive Ion Etch (RIE) system. Open load for flexible substrate handling. Etch gases are: Ar, CF4, CHF3, N2, O2, and SF6.

Details

Open load, so any size substrates are allowed.

Materials Restrictions

No metal films, and no dirty glasses (<99% SiO2) allowed.


Reactive Ion Etcher

Coral ID:Trion
Manufacturer: Trion
Model:Phantom
Lab:WNF
Area:Dry Etch
Manual:https://coral.engr.washington.edu/upload/manuals/Trion User Instructions.pdf

Description

A parallel-plate Reactive Ion Etch (RIE) system. Open load for flexible substrate handling. Etch gases are: SF6, CHF3, and O2.

Details

Any substrates and materials are allowed.

Materials Restrictions

(none)


Renishaw Raman Confocal

Coral ID:Raman-Microscope--Renishaw-InVia
Manufacturer: Renishaw
Model:InVia
Lab:MAF
Area:Thin Film and Materials Characterization
Manual:https://coral.engr.washington.edu/

Description

Raman spectroscopy for molecular characterization.; 514 nm and 784 nm lasers

Details

At this time only 1 laser - 785 nm is available.

Materials Restrictions

Currently no restrictions.


SPTS PECVD

Coral ID:PECVD2-SPTS
Manufacturer: SPTS
Model:SPM
Lab:WNF
Area:Thin Film Processing
Manual:https://coral.engr.washington.edu/upload/manuals/PECVD2-SOP.pdf

Description

Low temperature (125C) and high temperature ()350C), high-rate PECVD of SiO, SiN, and amorphous-Si on up to 200mm substrates with dual frequency supplies for stress tuning.

Details

This system runs automated depositions by first conditioning the chamber, then running the deposition, and then cleaning. This makes the deposited films very repeatable and minimizes the need for systems shutdowns to clean the chamber.

Materials Restrictions

Because the system runs at high temperatures it is imperative that samples be compatible with those temperatures. Prior to deposition on low temperature materials or plastics, consult with staff.


Sirion SEM

Coral ID:SEM--FEI-Sirion-XL30
Manufacturer: FEI
Model:Sirion XL30
Lab:MAF
Area:Inspection
Manual:https://coral.engr.washington.edu/upload/manuals/FEI XL30 SEM SOP.pdf

Description

Field Emission SEM with secondary and back-scatter electron imaging and Energy Dispersive X-ray Spectroscopy.

Details

The Sirion XL30 scanning electron microscope provides ultra-high resolution, low kV secondary electron and backscatter imaging from well-prepared samples using through-lens-detection technology. For standard gold on carbon substrate resolution is 3 nm at accelerating voltages of 1 kV - 30 kV.

Materials Restrictions

Samples must be conductive and vacuum safe to 10^-8 mTorr. Chamber will accommodate up to 5 cm diameter and 2 cm tall.


Spin Coater

Coral ID:SPIN3-EBeam
Manufacturer: Specialty Coating Systems
Model:SCS-6808P
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/SPIN3-EBeam SCS_Spinner_r4.pdf

Description

Manual, benchtop spin coater with vacuum chucking for samples from a few mm to 150mm wafers.

Details

(none given)

Materials Restrictions

Limited to use for Electron Beam Resists only!


Spin Coater

Coral ID:SPIN4-General
Manufacturer: Specialty Coating Systems
Model:SCS 6808P
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/SPIN4-General.pdf

Description

Flexible, manual bench-top spin coater with vacuum chucks available for pieces from a few mm up to 150 mm wafers.

Details

(none given)

Materials Restrictions

(none)


Surface Plasmon Resonance

Coral ID:SPR--Biacore-T100
Lab:BIOCOR
Area:Biological/Chemical/Particle Technology
Manual:https://coral.engr.washington.edu/

Description

Surface Plasmon Resonance (SPR) biosensor

Details

Kinetic and affinity data (KD, ka, kd), specificity, concentration and thermodynamics data

Materials Restrictions

(none)


Suss Spin Coater

Coral ID:SPIN1-Auto
Manufacturer: Suss Microtec
Model:LabSpin8
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/SPIN1-2_2.0.pdf

Description

Spin 100-200mm wafers, with a programmable controller, in a class 10 mini-environment, and a dedicated, electro-polished hotplate with automated wafer lift pins.

Details

(none given)

Materials Restrictions

(none)


Suss Spin Coaters

Coral ID:SPIN2-Auto
Manufacturer: Suss Microtec
Model:LabSpin8
Lab:WNF
Area:Lithography and Direct Patterning
Manual:https://coral.engr.washington.edu/upload/manuals/SPIN1-2_2.0.pdf

Description

Spin 100-200mm wafers, with a programmable controller, in a class 10 mini-environment, and a dedicated, electro-polished hotplate with automated wafer lift pins.

Details

(none given)

Materials Restrictions

(none)


Transmission Electron Microscope

Coral ID:TEM--FEI-Tecnai
Manufacturer: FEI
Model:Tecnai G2 F20
Lab:MAF
Area:Inspection
Manual:https://coral.engr.washington.edu/

Description

200 kV HR transmission electron microscope with scanning capabilities (S/TEM), EDAX, diffraction, and tomography. Supplied with a Gatan Ultrascan CCD digital camera.

Details

Contact Ellen Lavoie at lavoie@uw.edu for training or questions.

Materials Restrictions

3 hours per session up to 2 per week during business hours; currently unlimited hours during after hours times.


Ultracut 6 Microtome

Coral ID:Microtome--Leica-UC-6
Manufacturer: Leica
Model:UC-6
Lab:MAF
Manual:https://coral.engr.washington.edu/

Description

Automatic cutting microtome for either wet or dry sectioning of 20 nm-several microns.

Details

Full training including preparation of samples and use of diamond knife for ultrathin sectioning samples is offered.

Materials Restrictions

Currently none


Ultrasonic Disc Cutter

Coral ID:Disc-Cutter--Fischione-170
Manufacturer: Fischione
Model:170
Lab:MAF
Manual:https://coral.engr.washington.edu/

Description

Ultrasonically cut various size/shape discs for preparation of samples for TEM.

Details

(none given)

Materials Restrictions

Must contact staff for training and qualification.


Woollam Spectroscopic Ellipsometer

Coral ID:Ellipsometer--Woollam-M-2000
Manufacturer: Woollam
Model:M-2000
Lab:MAF
Area:Thin Film and Materials Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/Woollam Ellipsometer SOP_150311.docx

Description

Used for determination of thicknesses and optical parameters of thin films and multilayers; Spectral range: 210-1700nm; Spot size: normal > 1.5 mm, focused <150 μm; Sample mapping; Heating option: to 300 °C

Details

(none given)

Materials Restrictions

(none)


Coral ID:Woollam-Ellipsometer-Alpha-SE
Manufacturer: J.A. Woollam Co.
Model:alpha-SE
Lab:WNF
Area:Thin Film and Materials Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/Woollam alpha-SE Ellipsometer SOP.pdf

Description

The Woollam alpha-SE spectroscopic ellipsometer can be used to measure thickness and film properties of thin films.

Details

This system utilizes rotating compensator ellipsometry with high-speed CCD detection to collect data from the entire spectrum. The system has a spectral range of 380-890nm.

Materials Restrictions

Samples must be dry and clean before being placed on the sample stage. No samples that will leave a residue are allowed on the sample stage.


X-Ray Diffraction

Coral ID:XRD--Bruker-D8
Manufacturer: Bruker AXS
Model:D8 Discover with GADDS
Lab:MAF
Area:Device and Structure Characterization
Manual:https://coral.engr.washington.edu/upload/manuals/Bruker D8 july 2015 SOP_1.pdf

Description

X-ray diffraction tool for investigation of crystal structures; Advanced XRD with automated Laser-Video alignment system and 2D detector

Details

(none given)

Materials Restrictions

(none)


Coral ID:Zeiss-Axiotron
Manufacturer: Zeiss
Model:Axiotron
Lab:WNF
Area:Inspection
Manual:https://coral.engr.washington.edu/upload/manuals/Zeiss_Axiotron_Microscope_ver1.pdf

Description

High resolution optical microscope

Details

LED light source, brightfield, darkfield, and Nomarski (Differential Interference Contrast) imaging, with CCD image capturing.

Materials Restrictions

(none)


capillary Differential Scanning Calorimeter

Coral ID:capDSC
Lab:BIOCOR
Manual:https://coral.engr.washington.edu/

Description

Measurment of domain stability, melting temperature, and total thermodynamic determination of protein unfolding

Details

(none given)

Materials Restrictions

(none)